IEEE recently released its 2019 Heterogeneous Integration Roadmap (HIR) to the future of electronics, identifying technology requirements and potential solutions; its primary objective being to stimulate pre-competitive collaboration among industry, academia, and government to accelerate progress.
The roadmap offers professionals, industry, academia and research institutes a comprehensive, strategic forecast of technology over the next 15 years. The HIR also delivers a 25-year projection for heterogeneous integration of emerging devices and materials with longer research-and-development timelines.
“Today’s emerging technologies—AI, 5G, edge, cloud, datacentre, autonomous vehicles, and wearable technology—hold great promise for improving people’s lives across the globe,” said William Chen, chair of the Heterogeneous Integration Roadmap. “The HIR represents an invaluable resource that sets the course for continued electronics industry growth, greater technology innovation and enhanced performance of devices across a wide variety of applications.”
The electronics industry relies on the integration of separately manufactured components into higher-level assemblies to enable enhanced functionality and operations. This heterogeneous integration of wireless and mixed signal devices, bio-chips, power devices, optoelectronics and micro-electromechanical systems in a single package places new requirements on the electronics industry as these diverse components are introduced into System-in-Package (SiP) architectures for the tremendous array of industries where electronics are used.
“When you consider the scope of the HIR, the numerous application domains it addresses, and the level of valued input from a wide range of global stakeholders, it’s clear that there is a strong commitment to advance the entire electronics ecosystem,” said Ravi Mahajan, Intel Fellow, High Density Interconnect Pathfinding, Intel Corporation. “Today’s innovators, as well as future technologists, are encouraged to leverage the extensive, informative guidance contained within the HIR and actively participate in its future evolution.”